Development of insulated Cu wire ball bonding
Insulated Cu wire is the next generation technology in fine pitch and high density wire bonding, which enables wire crossing and touching without concern for wire-to-wire shorts. However, insulated Cu wire bonding is still at the infant stage compared to Cu wire bonding. This study investigates the...
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| 主要な著者: | , , , , , , |
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| その他の著者: | |
| フォーマット: | Conference paper |
| 出版事項: |
2023
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| 主題: | |
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