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Development of insulated Cu wire ball bonding

Insulated Cu wire is the next generation technology in fine pitch and high density wire bonding, which enables wire crossing and touching without concern for wire-to-wire shorts. However, insulated Cu wire bonding is still at the infant stage compared to Cu wire bonding. This study investigates the...

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書誌詳細
主要な著者:	Leong H.Y., Mohd F.Z., Ibrahim M.R., Kid W.B., Khan N., Kar Y.B., Tan L.C.
その他の著者:	55787052600
フォーマット:	Conference paper
出版事項:	2023
主題:	Bonding Electronics packaging Industrial electronics Manufacture Technology Bond structures Bonding parameters Bonding strength Cu-wire bondings Electric flame-off (EFO) Generation technologies Pad craterings Wire pull strength Wire
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

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