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The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint

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Bibliographic Details
Main Authors:	Mohd Arif Anuar, Mohd Salleh, Mohd Izrul Izwan, Ramli, Rita, Mohd Said, Mohd Mustafa Al Bakri, Abdullah, Dewi Suriyani, Che Halin, Norainiza, Saud, Nabiałek, Marcin
Other Authors:	arifanuar@unimap.edu.my
Format:	Article
Language:	English
Published:	MDPI AG 2022
Subjects:	Zinc Intermetallic compound IMC thickness Annealing process
Online Access:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74758
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