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The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint

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Main Authors: Mohd Arif Anuar, Mohd Salleh, Mohd Izrul Izwan, Ramli, Rita, Mohd Said, Mohd Mustafa Al Bakri, Abdullah, Dewi Suriyani, Che Halin, Norainiza, Saud, Nabiałek, Marcin
Other Authors: arifanuar@unimap.edu.my
Format: Article
Language:English
Published: MDPI AG 2022
Subjects:
Zinc
Intermetallic compound
IMC thickness
Annealing process
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74758
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spelling my.unimap-747582022-03-23T01:38:19Z The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint Mohd Arif Anuar, Mohd Salleh Mohd Izrul Izwan, Ramli Mohd Arif Anuar, Mohd Salleh Rita, Mohd Said Mohd Mustafa Al Bakri, Abdullah Dewi Suriyani, Che Halin Norainiza, Saud Nabiałek, Marcin arifanuar@unimap.edu.my Center of Excellence Geopolymer and Green Technology (CEGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP) Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP) Department of Physics, Czestochowa University of Technology Zinc Intermetallic compound IMC thickness Annealing process Link to publisher's homepage at https://www.mdpi.com/ The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu solder joint. The results indicated that the IMC layer’s thickness at the solder/Cu interface increases with annealing time. The interfacial IMC layer of the Sn-0.7Cu solder joint gradually thickened with increasing annealing time and annealing temperature, while the interfacial IMC layer’s morphology changed from scallop-type to layer-type after the annealing process. However, the addition of 1.0 wt.% and 1.5 wt.% Zn in the Sn-0.7Cu effectively altered the interfacial IMC phase to Cu-Zn and suppressed the growth of Cu3Sn during the annealing process. The single-lap shear tests results confirmed that the addition of Zn decreased the shear strength of Sn-0.7Cu. The interfacial IMC of the Cu6Sn5 phase in Sn-0.7Cu changed to Cu-Zn due to the addition of Zn. The shear fractures in the annealed solder joint were ductile within the bulk solder instead of the interfacial IMC layer. Increased annealing time resulted in the increased presence of the Cu-Zn phase, which decreased the hardness and shear strength of the Sn-0.7Cu solder joint 2022 2022-03-23T01:38:19Z 2022-03-23T01:38:19Z 2021-02 Article Metals, vol.11(3), 2021, 11 pages 2075-4701 http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74758 https://doi.org/10.3390/met11030380 en MDPI AG
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Zinc
Intermetallic compound
IMC thickness
Annealing process
spellingShingle Zinc
Intermetallic compound
IMC thickness
Annealing process
Mohd Arif Anuar, Mohd Salleh
Mohd Izrul Izwan, Ramli
Mohd Arif Anuar, Mohd Salleh
Rita, Mohd Said
Mohd Mustafa Al Bakri, Abdullah
Dewi Suriyani, Che Halin
Norainiza, Saud
Nabiałek, Marcin
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
description Link to publisher's homepage at https://www.mdpi.com/
author2 arifanuar@unimap.edu.my
author_facet arifanuar@unimap.edu.my
Mohd Arif Anuar, Mohd Salleh
Mohd Izrul Izwan, Ramli
Mohd Arif Anuar, Mohd Salleh
Rita, Mohd Said
Mohd Mustafa Al Bakri, Abdullah
Dewi Suriyani, Che Halin
Norainiza, Saud
Nabiałek, Marcin
format Article
author Mohd Arif Anuar, Mohd Salleh
Mohd Izrul Izwan, Ramli
Mohd Arif Anuar, Mohd Salleh
Rita, Mohd Said
Mohd Mustafa Al Bakri, Abdullah
Dewi Suriyani, Che Halin
Norainiza, Saud
Nabiałek, Marcin
author_sort Mohd Arif Anuar, Mohd Salleh
title The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
title_short The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
title_full The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
title_fullStr The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
title_full_unstemmed The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
title_sort effect of thermal annealing on the microstructure and mechanical properties of sn-0.7cu-xzn solder joint
publisher MDPI AG
publishDate 2022
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74758
_version_ 1729704802575712256
score 13.222552

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