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Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition

The effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method were studied in this paper. Some statistical analysis base on the pull test data also discussed. Three samples of different lead free solder joint material were sele...

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Bibliographic Details
Main Authors: Harif M.N., Ahmad I.
Other Authors: 22634024000
Format: Conference paper
Published: 2023
Subjects:
Lead free
Pull test and IMC thicknesses
Solder joint
Chip scale packages
Intermetallics
Materials
Mechanical properties
Semiconductor growth
Silver
Soldering alloys
Spheres
Testing
Thermoelectric equipment
Units of measurement
After high temperature
High temperature storage
High-power
Image analyzers
IMC thickness
Intermetallic compounds
Intermetallic thickness
Joint effect
Joint reliability
Joint strength
Lead-Free
Lead-free solder joint
Per unit
Pull strength
Sample sizes
Semiconductor packaging
Sn-3.5Ag
Sn3.5Ag solder
Solder joints
Solder-joint strength
Statistical analysis
Test data
Test machine
Test method
Test results
Thermal condition
Thermal condition tests
Lead
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