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Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

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書誌詳細
主要な著者:	Yap, Boon Kar, Dr., Noor Azrina, Talik, Zaliman, Sauli, Dr., Retnasamy, Vithyacharan
その他の著者:	kbyap@uniten.edu.my
フォーマット:	論文
言語:	English
出版事項:	Emerald Group Publishing Limited 2014
主題:	ABAQUS Finite element analysis Flip chip Solder ball Stress (materials) Thermal analysis
オンライン･アクセス:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33891
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

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