Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology
Purpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment process, could affect the package long-term performance. Design/methodology...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Published: |
2023
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