实物特征: Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

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书目详细资料
Main Authors:	Yap, Boon Kar, Dr., Noor Azrina, Talik, Zaliman, Sauli, Dr., Retnasamy, Vithyacharan
其他作者:	kbyap@uniten.edu.my
格式:	Article
语言:	English
出版:	Emerald Group Publishing Limited 2014
主题:	ABAQUS Finite element analysis Flip chip Solder ball Stress (materials) Thermal analysis
在线阅读:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33891
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实物特征
总结:	Link to publisher's homepage at http://www.emeraldinsight.com/