Yap, B. K., & kbyap@uniten.edu.my. (2014). Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS. Emerald Group Publishing Limited.
Chicago Style CitationYap, Boon Kar, and kbyap@uniten.edu.my. Finite Element Analysis of Thermal Distributions of Solder Ball in Flip Chip Ball Grid Array Using ABAQUS. Emerald Group Publishing Limited, 2014.
MLA CitationYap, Boon Kar, and kbyap@uniten.edu.my. Finite Element Analysis of Thermal Distributions of Solder Ball in Flip Chip Ball Grid Array Using ABAQUS. Emerald Group Publishing Limited, 2014.
Warning: These citations may not always be 100% accurate.