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Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication

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Bibliographic Details
Main Authors:	Muhamad Hafiz, Zan @ Hazizi, Mohd Arif Anuar, Mohd Salleh, Zainal Arifin, Ahmad, Prof., Mohd Mustafa Al-Bakri, Abdullah, Alida, Abdullah, Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
Other Authors:	hafizhazizi@unimap.edu.my
Format:	Article
Language:	English
Published:	Trans Tech Publications 2014
Subjects:	Composite Lead-free solder Powder metallurgy Silicon nitride Sn-0.7Cu
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33180
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