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Surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad

The advancement of technology in the micro and nano electronic niche has changed the aspects of interconnection of electrical connectivity. Surface adhesion of electronic device fabrication has propelled tribology element on layers and bonding of this devices as an important element. Surface roug...

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書目詳細資料
主要作者:	Vithyacharan, Retnasamy
格式:	Thesis
語言:	English
出版:	Universiti Malaysia Perlis (UniMAP) 2014
主題:	Gold ball bonds Aluminum bond pad Surface adhesion Surface roughness Gold wire bonding
在線閱讀:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33139
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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