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Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application

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书目详细资料
主要作者:	Siti Amira Faisha Shikh Zakaria
其他作者:	Prof. Madya. Ir. Mohabattul Zaman Sns Bukhari
格式:	Learning Object
语言:	English
出版:	Universiti Malaysia Perlis 2012
主题:	SiC powder Materials engineering Cooper silicon carbide Silicon carbide Powder metallurgy
在线阅读:	http://dspace.unimap.edu.my/xmlui/handle/123456789/19839
标签:	添加标签没有标签, 成为第一个标记此记录!

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