Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application
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保存先:
第一著者: | Siti Amira Faisha Shikh Zakaria |
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その他の著者: | Prof. Madya. Ir. Mohabattul Zaman Sns Bukhari |
フォーマット: | Learning Object |
言語: | English |
出版事項: |
Universiti Malaysia Perlis
2012
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主題: | |
オンライン・アクセス: | http://dspace.unimap.edu.my/xmlui/handle/123456789/19839 |
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