Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application
Shrinking size and increasing functionality of IC device has induced serious thermal problem. Good thermal dissipation, light weight and easy-to-process material, such as CuSiC, is a highly potential heat spreader material to cope thermal problem. Powder metallurgy method is chosen to fabricate Cu...
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| フォーマット: | Learning Object |
| 言語: | English |
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Universiti Malaysia Perlis
2008
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| オンライン･アクセス: | http://dspace.unimap.edu.my/xmlui/handle/123456789/3374 |
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