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Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application

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書目詳細資料
主要作者:	Siti Amira Faisha Shikh Zakaria
其他作者:	Prof. Madya. Ir. Mohabattul Zaman Sns Bukhari
格式:	Learning Object
語言:	English
出版:	Universiti Malaysia Perlis 2012
主題:	SiC powder Materials engineering Cooper silicon carbide Silicon carbide Powder metallurgy
在線閱讀:	http://dspace.unimap.edu.my/xmlui/handle/123456789/19839
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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