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Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing

Purpose - The purpose of this paper is to investigate the effects of addition Co nanoparticles on the characteristic properties of Sn-3.8Ag-0.7Cu solder. Design/methodology/approach - Cobalt (Co) nanoparticles were added to Sn-Ag-Cu solders by thoroughly blending various weight percentages (0-2.0 wt...

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書目詳細資料
Main Authors:	Tay, S.L., Haseeb, A.S. Md. Abdul, Johan, M.R.
格式:	Article
出版:	2011
主題:	T Technology (General)
在線閱讀:	http://eprints.um.edu.my/5468/
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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