Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength
Reflow profile parameter with reducing soaking time demonstrated better solder joint performance in Lead-free BGA semiconductor packages. Hence, this paper studied the lead-free solder joint strength using two different reflow profiles: conventional ramp-soak-peak (RSP) and ramp to peak (RTP) for so...
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| Main Authors: | , , , , |
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2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5311 |
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