表紙画像

Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing

Purpose - The purpose of this paper is to investigate the effects of addition Co nanoparticles on the characteristic properties of Sn-3.8Ag-0.7Cu solder. Design/methodology/approach - Cobalt (Co) nanoparticles were added to Sn-Ag-Cu solders by thoroughly blending various weight percentages (0-2.0 wt...

詳細記述

保存先:
書誌詳細
主要な著者: Tay, S.L., Haseeb, A.S. Md. Abdul, Johan, M.R.
フォーマット: 論文
出版事項: 2011
主題:
T Technology (General)
オンライン･アクセス:http://eprints.um.edu.my/5468/
タグ: タグ追加
タグなし, このレコードへの初めてのタグを付けませんか!
id my.um.eprints.5468
record_format eprints
spelling my.um.eprints.54682018-10-17T00:50:54Z http://eprints.um.edu.my/5468/ Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing Tay, S.L. Haseeb, A.S. Md. Abdul Johan, M.R. T Technology (General) Purpose - The purpose of this paper is to investigate the effects of addition Co nanoparticles on the characteristic properties of Sn-3.8Ag-0.7Cu solder. Design/methodology/approach - Cobalt (Co) nanoparticles were added to Sn-Ag-Cu solders by thoroughly blending various weight percentages (0-2.0 wt) of Co nanoparticles with near eutectic SAC387 solder paste. Blending was done mechanically for 30 min to ensure a homogeneous mixture. The paste mixture was then reflowed on a hot plate at 250 degrees C for 45s. The melting points of nanocomposite solder were determined by differential scanning calorimetry. Spreading rate of nanocomposite was calculated following the JIS Z3198-3 standard. The wetting angle was measured after cross-sectional metallographic preparation. Findings - No significant change in melting point of the solder was observed as a result of Co nanoparticle addition. The wetting angles of the solder increased with the addition of nanoparticles, while the spreading rate decreased. Although the wetting angle increased, the values were still within the acceptable range. Scanning micrograph observations revealed that the as-solidified microstructure of the composite solder was altered by the addition of Co nanoparticles. Microhardness of the solders slightly increased upon Co nanoparticles addition to SAC387. Originality/value - The paper demonstrates that a simple process like paste mixing can be used to incorporate nanoparticles into solder. 2011 Article PeerReviewed Tay, S.L. and Haseeb, A.S. Md. Abdul and Johan, M.R. (2011) Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing. Soldering & Surface Mount Technology, 23 (1). pp. 10-14. ISSN 0954-0911
institution Universiti Malaya
building UM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaya
content_source UM Research Repository
url_provider http://eprints.um.edu.my/
topic T Technology (General)
spellingShingle T Technology (General)
Tay, S.L.
Haseeb, A.S. Md. Abdul
Johan, M.R.
Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing
description Purpose - The purpose of this paper is to investigate the effects of addition Co nanoparticles on the characteristic properties of Sn-3.8Ag-0.7Cu solder. Design/methodology/approach - Cobalt (Co) nanoparticles were added to Sn-Ag-Cu solders by thoroughly blending various weight percentages (0-2.0 wt) of Co nanoparticles with near eutectic SAC387 solder paste. Blending was done mechanically for 30 min to ensure a homogeneous mixture. The paste mixture was then reflowed on a hot plate at 250 degrees C for 45s. The melting points of nanocomposite solder were determined by differential scanning calorimetry. Spreading rate of nanocomposite was calculated following the JIS Z3198-3 standard. The wetting angle was measured after cross-sectional metallographic preparation. Findings - No significant change in melting point of the solder was observed as a result of Co nanoparticle addition. The wetting angles of the solder increased with the addition of nanoparticles, while the spreading rate decreased. Although the wetting angle increased, the values were still within the acceptable range. Scanning micrograph observations revealed that the as-solidified microstructure of the composite solder was altered by the addition of Co nanoparticles. Microhardness of the solders slightly increased upon Co nanoparticles addition to SAC387. Originality/value - The paper demonstrates that a simple process like paste mixing can be used to incorporate nanoparticles into solder.
format Article
author Tay, S.L.
Haseeb, A.S. Md. Abdul
Johan, M.R.
author_facet Tay, S.L.
Haseeb, A.S. Md. Abdul
Johan, M.R.
author_sort Tay, S.L.
title Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing
title_short Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing
title_full Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing
title_fullStr Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing
title_full_unstemmed Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing
title_sort addition of cobalt nanoparticles into sn-3.8ag-0.7cu lead-free solder by paste mixing
publishDate 2011
url http://eprints.um.edu.my/5468/
_version_ 1643687585005961216
score 13.251813

類似資料