Stress intensity factors for thermoelectric bonded materials weakened by an inclined crack
Thermoelectric Bonded Materials (TEBM) weakened by an Inclined Crack Problems (ICP) subjected to remote stress was presented in this study. The problems are addressed by employing the Modified Complex Variable Function (MCVF) method, which incorporates the Continuity Conditions (CC) for the Resultan...
محفوظ في:
المؤلفون الرئيسيون: | Hamzah, Khairum, Waini, Iskandar, Mohd Nordin, Muhammad Haziq Iqmal, Nik Long, Nik Mohd Asri, Sayed Nordin, Sayed Kushairi, Khashi’ie, Najiyah Safwa, Zainal, Nurul Amira |
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التنسيق: | مقال |
اللغة: | English |
منشور في: |
Semarak Ilmu Publishing
2024
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الوصول للمادة أونلاين: | http://eprints.utem.edu.my/id/eprint/27245/2/0215325012024131630693.PDF http://eprints.utem.edu.my/id/eprint/27245/ https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/4373/3597 |
الوسوم: |
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مواد مشابهة
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Stress intensity factors for Thermoelectric Bonded Materials weakened by an inclined crack
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منشور في: (2024) -
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Numerical solution for a curvilinear crack phenomenon in thermoelectric bonded materials subjected to mechanical loadings
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بواسطة: Hamzah, Khairum, وآخرون
منشور في: (2023) -
Formulation for multiple cracks problem in thermoelectric-bonded materials using hypersingular integral equations
بواسطة: Mohd Nordin, Muhammad Haziq Iqmal, وآخرون
منشور في: (2023)