Stress intensity factors for thermoelectric bonded materials weakened by an inclined crack

Thermoelectric Bonded Materials (TEBM) weakened by an Inclined Crack Problems (ICP) subjected to remote stress was presented in this study. The problems are addressed by employing the Modified Complex Variable Function (MCVF) method, which incorporates the Continuity Conditions (CC) for the Resultan...

全面介紹

Saved in:
書目詳細資料
Main Authors: Hamzah, Khairum, Waini, Iskandar, Mohd Nordin, Muhammad Haziq Iqmal, Nik Long, Nik Mohd Asri, Sayed Nordin, Sayed Kushairi, Khashi’ie, Najiyah Safwa, Zainal, Nurul Amira
格式: Article
語言:English
出版: Semarak Ilmu Publishing 2024
在線閱讀:http://eprints.utem.edu.my/id/eprint/27245/2/0215325012024131630693.PDF
http://eprints.utem.edu.my/id/eprint/27245/
https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/4373/3597
標簽: 添加標簽
沒有標簽, 成為第一個標記此記錄!