Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations
The new system of hypersingular integral equations (HSIEs) for the thermally insulated inclined cracks and thermally insulated circular arc cracks subjected to remote shear stress in bonded dissimilar materials was formulated by using the modified complex potentials (MCPs) function method with the...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier Inc.
2021
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| Online Access: | http://eprints.utem.edu.my/id/eprint/25517/2/PUBLISH%20VERSION.PDF http://eprints.utem.edu.my/id/eprint/25517/ https://www.sciencedirect.com/science/article/pii/S0307904X20305758 https://doi.org/10.1016/j.apm.2020.09.054 |
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