Stress intensity factors for thermoelectric bonded materials weakened by an inclined crack
Thermoelectric Bonded Materials (TEBM) weakened by an Inclined Crack Problems (ICP) subjected to remote stress was presented in this study. The problems are addressed by employing the Modified Complex Variable Function (MCVF) method, which incorporates the Continuity Conditions (CC) for the Resultan...
保存先:
| 主要な著者: | , , , , , , |
|---|---|
| フォーマット: | 論文 |
| 言語: | English |
| 出版事項: |
Semarak Ilmu Publishing
2024
|
| オンライン･アクセス: | http://eprints.utem.edu.my/id/eprint/27245/2/0215325012024131630693.PDF http://eprints.utem.edu.my/id/eprint/27245/ https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/4373/3597 |
| タグ: |
タグ追加
タグなし, このレコードへの初めてのタグを付けませんか!
|
| id |
my.utem.eprints.27245 |
|---|---|
| record_format |
eprints |
| spelling |
my.utem.eprints.272452024-07-01T09:50:33Z http://eprints.utem.edu.my/id/eprint/27245/ Stress intensity factors for thermoelectric bonded materials weakened by an inclined crack Hamzah, Khairum Waini, Iskandar Mohd Nordin, Muhammad Haziq Iqmal Nik Long, Nik Mohd Asri Sayed Nordin, Sayed Kushairi Khashi’ie, Najiyah Safwa Zainal, Nurul Amira Thermoelectric Bonded Materials (TEBM) weakened by an Inclined Crack Problems (ICP) subjected to remote stress was presented in this study. The problems are addressed by employing the Modified Complex Variable Function (MCVF) method, which incorporates the Continuity Conditions (CC) for the Resultant Electric Force (REF) and Displacement Electric Function (DEF) to formulate the Hypersingular Integral Equations (HSIEs) associated with these problems. By applying the curved length coordinate method, the unknown functions of Crack Opening Displacement (COD), Electric Current Density (ECD), and Energy Flux Load (EFL) are mapped onto the square root singularity function. The resulting equations are then numerically solved using appropriate quadrature formulas, with the traction along the crack utilized as the right-hand term. The obtained COD, ECD and EFL functions is then used to compute the dimensionless Stress Intensity Factors (SIFs) in order to determine the stability behavior of TEBM weakened by an ICP. The numerical results provided demonstrate the dimensionless SIFs at the crack tips. These results exhibit excellent agreement with previous studies conducted on the subject. Additionally, it is observed that the dimensionless SIFs at the crack tips are influenced by factors such as the ratio of Elastic Constants (ECR), the geometry of the cracks, and the coefficients associated with the Electric Current Density (ECD). Semarak Ilmu Publishing 2024-01 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/27245/2/0215325012024131630693.PDF Hamzah, Khairum and Waini, Iskandar and Mohd Nordin, Muhammad Haziq Iqmal and Nik Long, Nik Mohd Asri and Sayed Nordin, Sayed Kushairi and Khashi’ie, Najiyah Safwa and Zainal, Nurul Amira (2024) Stress intensity factors for thermoelectric bonded materials weakened by an inclined crack. Journal of Advanced Research in Applied Mechanics, 113 (1). pp. 52-62. ISSN 2289-7895 https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/4373/3597 10.37934/aram.113.1.5262 |
| institution |
Universiti Teknikal Malaysia Melaka |
| building |
UTEM Library |
| collection |
Institutional Repository |
| continent |
Asia |
| country |
Malaysia |
| content_provider |
Universiti Teknikal Malaysia Melaka |
| content_source |
UTEM Institutional Repository |
| url_provider |
http://eprints.utem.edu.my/ |
| language |
English |
| description |
Thermoelectric Bonded Materials (TEBM) weakened by an Inclined Crack Problems (ICP) subjected to remote stress was presented in this study. The problems are addressed by employing the Modified Complex Variable Function (MCVF) method, which incorporates the Continuity Conditions (CC) for the Resultant Electric Force (REF) and Displacement Electric Function (DEF) to formulate the Hypersingular Integral Equations (HSIEs) associated with these problems. By applying the curved length coordinate method, the unknown functions of Crack Opening Displacement (COD), Electric Current Density (ECD), and Energy Flux Load (EFL) are mapped onto the square root singularity function. The resulting equations are then numerically solved using appropriate quadrature formulas, with the traction along the crack utilized as the right-hand term. The obtained COD, ECD and EFL functions is then used to compute the dimensionless Stress Intensity Factors (SIFs) in order to determine the stability behavior of TEBM weakened by an ICP. The numerical results provided demonstrate the dimensionless SIFs at the crack tips. These results exhibit excellent agreement with previous studies conducted on the subject. Additionally, it is observed that the dimensionless SIFs at the crack tips are influenced by factors such as the ratio of Elastic Constants (ECR), the geometry of the cracks, and the coefficients associated with the Electric Current Density (ECD). |
| format |
Article |
| author |
Hamzah, Khairum Waini, Iskandar Mohd Nordin, Muhammad Haziq Iqmal Nik Long, Nik Mohd Asri Sayed Nordin, Sayed Kushairi Khashi’ie, Najiyah Safwa Zainal, Nurul Amira |
| spellingShingle |
Hamzah, Khairum Waini, Iskandar Mohd Nordin, Muhammad Haziq Iqmal Nik Long, Nik Mohd Asri Sayed Nordin, Sayed Kushairi Khashi’ie, Najiyah Safwa Zainal, Nurul Amira Stress intensity factors for thermoelectric bonded materials weakened by an inclined crack |
| author_facet |
Hamzah, Khairum Waini, Iskandar Mohd Nordin, Muhammad Haziq Iqmal Nik Long, Nik Mohd Asri Sayed Nordin, Sayed Kushairi Khashi’ie, Najiyah Safwa Zainal, Nurul Amira |
| author_sort |
Hamzah, Khairum |
| title |
Stress intensity factors for thermoelectric bonded materials weakened by an inclined crack |
| title_short |
Stress intensity factors for thermoelectric bonded materials weakened by an inclined crack |
| title_full |
Stress intensity factors for thermoelectric bonded materials weakened by an inclined crack |
| title_fullStr |
Stress intensity factors for thermoelectric bonded materials weakened by an inclined crack |
| title_full_unstemmed |
Stress intensity factors for thermoelectric bonded materials weakened by an inclined crack |
| title_sort |
stress intensity factors for thermoelectric bonded materials weakened by an inclined crack |
| publisher |
Semarak Ilmu Publishing |
| publishDate |
2024 |
| url |
http://eprints.utem.edu.my/id/eprint/27245/2/0215325012024131630693.PDF http://eprints.utem.edu.my/id/eprint/27245/ https://semarakilmu.com.my/journals/index.php/appl_mech/article/view/4373/3597 |
| _version_ |
1804070305500495872 |
| score |
13.251813 |