Electrical and microstructures properties of polygate electrode in 0.5 μm CMOS devices

The effect of phosphorus, doped by in-situ and by ion implantation on poly silicon, as a gate electrode of 0.5 μm CMOS was investigated. The result shows that a two-step annealing is required to cure the radiation damage and activate the dopant in reducing the sheet resistance of the ion implanted g...

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Main Authors: Omar, A., Ahmad, I., Alias, A.J.
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Published: 2017
Online Access:http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5337
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spelling my.uniten.dspace-53372017-11-15T02:57:36Z Electrical and microstructures properties of polygate electrode in 0.5 μm CMOS devices Omar, A. Ahmad, I. Alias, A.J. The effect of phosphorus, doped by in-situ and by ion implantation on poly silicon, as a gate electrode of 0.5 μm CMOS was investigated. The result shows that a two-step annealing is required to cure the radiation damage and activate the dopant in reducing the sheet resistance of the ion implanted gate electrode. The introduction of phosphorus from 7×10 15 to 3×l0 l6/cm 3 by ion implantation at 40 keV has reduced the sheet resistance from 100 ohm/ to 25 ohm/ comparable to the gate produced by in-situ phosphorus doping. The microstructures of polysilicon gate electrode were studied using TEM. and found that grains of samples in polysilicon doped by in-situ are larger than other samples. © 2000 IEEE. 2017-11-15T02:57:36Z 2017-11-15T02:57:36Z 2000 http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5337
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
description The effect of phosphorus, doped by in-situ and by ion implantation on poly silicon, as a gate electrode of 0.5 μm CMOS was investigated. The result shows that a two-step annealing is required to cure the radiation damage and activate the dopant in reducing the sheet resistance of the ion implanted gate electrode. The introduction of phosphorus from 7×10 15 to 3×l0 l6/cm 3 by ion implantation at 40 keV has reduced the sheet resistance from 100 ohm/ to 25 ohm/ comparable to the gate produced by in-situ phosphorus doping. The microstructures of polysilicon gate electrode were studied using TEM. and found that grains of samples in polysilicon doped by in-situ are larger than other samples. © 2000 IEEE.
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author Omar, A.
Ahmad, I.
Alias, A.J.
spellingShingle Omar, A.
Ahmad, I.
Alias, A.J.
Electrical and microstructures properties of polygate electrode in 0.5 μm CMOS devices
author_facet Omar, A.
Ahmad, I.
Alias, A.J.
author_sort Omar, A.
title Electrical and microstructures properties of polygate electrode in 0.5 μm CMOS devices
title_short Electrical and microstructures properties of polygate electrode in 0.5 μm CMOS devices
title_full Electrical and microstructures properties of polygate electrode in 0.5 μm CMOS devices
title_fullStr Electrical and microstructures properties of polygate electrode in 0.5 μm CMOS devices
title_full_unstemmed Electrical and microstructures properties of polygate electrode in 0.5 μm CMOS devices
title_sort electrical and microstructures properties of polygate electrode in 0.5 μm cmos devices
publishDate 2017
url http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5337
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score 13.223943