A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish
As the world is changing to Pb-free solder per EU ROHS Directive, the higher reflow temperature requirement for Pb-free solder has demanded better substrate metal trace to solder mask adhesion to prevent delamination problem. Hence, selective Ni/Au plating process becomes more appealing in the fabri...
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| Main Authors: | , , , , , |
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2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5292 |
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