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Improvement of Cu-Al bond integrity on low k pad structures

Gold wires are commonly used for wire-bonding and it fits well the industrial requirements. However, the price of Gold wires increasing significantly, Copper wires is a potential replacement for Gold due to their superior electrical and mechanical properties. In order to incorporate Cu in the wire-b...

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書誌詳細
主要な著者:	Kid W.B., Leng E.P., Yong C.C., Yi O.X., Kar Y.B.
その他の著者:	36992192300
フォーマット:	Conference paper
出版事項:	2023
主題:	Copper Electric properties Gold Intermetallics Mechanical properties Thermal aging Wire Bond integrities Copper wires Diffusion rate Electrical and mechanical properties Gold wire Higher temperatures Industrial requirements Intermetallic formation Pad structures Wire bonds Wirebonding Aluminum
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