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Characterization of intermetallic growth of gold ball bonds on aluminum bond pads

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Main Authors:	Mohd Khairuddin, Md Arshad, Lim, Moy Fung, Mohammad Nuzaihan Md. Noor, Uda, Hashim
其他作者:	mohd.khairuddin@unimap.edu.my
格式:	Article
语言:	English
出版:	University of Malaya 2009
主题:	Au-Al Interdiffusion Intermetallic Gold wire bonding Aluminum bond pad Intermetallic growth
在线阅读:	http://dspace.unimap.edu.my/xmlui/handle/123456789/7421
标签:	添加标签没有标签, 成为第一个标记此记录!

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