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Wire bond shear test simulation on hemispherical surface bond pad

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書誌詳細
主要な著者:	Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Wan Mokhzani, Wan Norhaimi, Johari, Adnan, Assc. Prof. Dr., Palianysamy, Moganraj
その他の著者:	W.M.W. Norhaimi, J. Adnan, M. Palianysamy
フォーマット:	論文
言語:	English
出版事項:	Trans Tech Publications 2014
主題:	ANSYS Hemisphere surface bond pad Shear test Wire bond
オンライン･アクセス:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/32646
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

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