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Research development of solder materials and its intermetallic compound (IMC) study

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Bibliographic Details
Main Authors:	Mohd Arif Anuar, Mohd Salleh, Najib S., Ibrahim, Saud, N., Mohd Mustafa Al Bakri, Abdullah, Nik Noriman, Zulkepli, Ramani, Mayapan, Zainal Ariffin, Ahmad
Other Authors:	arifanuar@unimap.edu.my
Format:	Article
Language:	English
Published:	Scientific.Net/Trans Tech Publications 2014
Subjects:	Composite Intermetallic compound Lead-Free solder Solder fabrication
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/32033
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