Simulation of nano carbon tube (NCT) in thermal interface material for electronic packaging application by using CFD software
This paper presents the nanocarbon tube in thermal interface material for electronic packaging application by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of electronic packaging is built using GAMBIT and simulated using FLUENT software. The study was made...
Saved in:
| Main Authors: | , , , , , , |
|---|---|
| 格式: | Non-Indexed Article |
| 出版: |
2015
|
| 在線閱讀: | http://discol.umk.edu.my/id/eprint/7973/ http://www.scientific.net/MSF.803.337 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|