The effect of gap between plastic leaded chip carrier (PLCC) using Computational Fluid Dynamic (CFD) Software, FLUENT
This paper presents the effect of gap between Plastic Leaded Chip Carrier (PLCC) by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for twomicroprocessors arran...
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| Main Authors: | , , , , , , , |
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| Format: | Non-Indexed Article |
| Online Access: | http://discol.umk.edu.my/id/eprint/7900/ http://www.aensiweb.com/aeb/2013/3843-3849.pdf |
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