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Simulation of nano carbon tube (NCT) in thermal interface material for electronic packaging application by using CFD software

This paper presents the nanocarbon tube in thermal interface material for electronic packaging application by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of electronic packaging is built using GAMBIT and simulated using FLUENT software. The study was made...

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Main Authors: Mazlan Mohamed, A.M. Mustafa Al Bakri, Razak Wahab, Zulhisyam Abdul Kari @ Abdullah, Muhammad Iqbal Ahmad, Mohd Hazim Mohamad Amini, Mohammad Amizi Ayob
Format: Non-Indexed Article
Published: 2015
Online Access:http://discol.umk.edu.my/id/eprint/7973/
http://www.scientific.net/MSF.803.337
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spelling my.umk.eprints.79732022-05-23T10:24:26Z http://discol.umk.edu.my/id/eprint/7973/ Simulation of nano carbon tube (NCT) in thermal interface material for electronic packaging application by using CFD software Mazlan Mohamed A.M. Mustafa Al Bakri Razak Wahab Zulhisyam Abdul Kari @ Abdullah Muhammad Iqbal Ahmad Mohd Hazim Mohamad Amini Mohammad Amizi Ayob This paper presents the nanocarbon tube in thermal interface material for electronic packaging application by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of electronic packaging is built using GAMBIT and simulated using FLUENT software. The study was made for a microprocessors arranged in line under different types of inlet velocities and package (chip) powers. The results are presented in terms of average junction temperature when chip powers have been increased from 2 W to 5 W. The junction temperature is been observed and it was found that the junction temperature of the electronic packaging using nanocarbon was able to wind stand the increasing in chip power from 2 W until 5 W. It also found that the material selection play important roles to control and manage the junction temperature. The strength of CFD software in handling heat transfer problems is proved to be excellent. 2015 Non-Indexed Article NonPeerReviewed Mazlan Mohamed and A.M. Mustafa Al Bakri and Razak Wahab and Zulhisyam Abdul Kari @ Abdullah and Muhammad Iqbal Ahmad and Mohd Hazim Mohamad Amini and Mohammad Amizi Ayob (2015) Simulation of nano carbon tube (NCT) in thermal interface material for electronic packaging application by using CFD software. Materials Science Forum, 803. pp. 337-342. ISSN 1662-9752 http://www.scientific.net/MSF.803.337
institution Universiti Malaysia Kelantan
building Perpustakaan Universiti Malaysia Kelantan
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Kelantan
content_source UMK Institutional Repository
url_provider http://umkeprints.umk.edu.my/
description This paper presents the nanocarbon tube in thermal interface material for electronic packaging application by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of electronic packaging is built using GAMBIT and simulated using FLUENT software. The study was made for a microprocessors arranged in line under different types of inlet velocities and package (chip) powers. The results are presented in terms of average junction temperature when chip powers have been increased from 2 W to 5 W. The junction temperature is been observed and it was found that the junction temperature of the electronic packaging using nanocarbon was able to wind stand the increasing in chip power from 2 W until 5 W. It also found that the material selection play important roles to control and manage the junction temperature. The strength of CFD software in handling heat transfer problems is proved to be excellent.
format Non-Indexed Article
author Mazlan Mohamed
A.M. Mustafa Al Bakri
Razak Wahab
Zulhisyam Abdul Kari @ Abdullah
Muhammad Iqbal Ahmad
Mohd Hazim Mohamad Amini
Mohammad Amizi Ayob
spellingShingle Mazlan Mohamed
A.M. Mustafa Al Bakri
Razak Wahab
Zulhisyam Abdul Kari @ Abdullah
Muhammad Iqbal Ahmad
Mohd Hazim Mohamad Amini
Mohammad Amizi Ayob
Simulation of nano carbon tube (NCT) in thermal interface material for electronic packaging application by using CFD software
author_facet Mazlan Mohamed
A.M. Mustafa Al Bakri
Razak Wahab
Zulhisyam Abdul Kari @ Abdullah
Muhammad Iqbal Ahmad
Mohd Hazim Mohamad Amini
Mohammad Amizi Ayob
author_sort Mazlan Mohamed
title Simulation of nano carbon tube (NCT) in thermal interface material for electronic packaging application by using CFD software
title_short Simulation of nano carbon tube (NCT) in thermal interface material for electronic packaging application by using CFD software
title_full Simulation of nano carbon tube (NCT) in thermal interface material for electronic packaging application by using CFD software
title_fullStr Simulation of nano carbon tube (NCT) in thermal interface material for electronic packaging application by using CFD software
title_full_unstemmed Simulation of nano carbon tube (NCT) in thermal interface material for electronic packaging application by using CFD software
title_sort simulation of nano carbon tube (nct) in thermal interface material for electronic packaging application by using cfd software
publishDate 2015
url http://discol.umk.edu.my/id/eprint/7973/
http://www.scientific.net/MSF.803.337
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score 13.222552

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