Three dimensional analysis of thermal pad made of nanomaterial, nano-silver with differences of thickness by using CFD software, FLUENT
This paper presents the thermal management of electronic components, microprocessor by using three dimensional numerical analysis of heat and fluid flow in computer using CFD Software. 3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for four...
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| Main Authors: | , , , , , |
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| Format: | Non-Indexed Article |
| Published: |
2013
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| Online Access: | http://discol.umk.edu.my/id/eprint/7859/ http://www.ajbasweb.com/ajbas/2013/Special,%20issue2%202013/220-229.pdf |
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