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Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nanosilver in Semiconductor and Electronic Component Application

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Bibliographic Details
Main Authors:	Mohamed, Mazlan, Atan, Rahim, Mustafa Al Bakri, Abdullah Mohd, Ahmad, Muhammad Iqbal, Yusoff, Mohd Huzaifah, Saad, Fathinul Najib Ahmad
Format:	Non-Indexed Article
Language:	English
Published:	Trans-Tech Publication 2012
Online Access:	http://discol.umk.edu.my/id/eprint/7882/1/AMR.626.980.pdf http://discol.umk.edu.my/id/eprint/7882/ http://dx.doi.org/10.4028/www.scientific.net/AMR.626.980
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