Three dimensional simulation of thermal pad using nanomaterial, nanosilver in semiconductor and electronic component application
Thermal pad is new technology in this world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. In electronic industry, the electronic components that exceed 70ºC will malfunction and damage due to the overheated. The design is used nano-silv...
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| Main Authors: | , , , , , |
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| Format: | Non-Indexed Article |
| Published: |
Trans-Tech Publication
2012
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| Online Access: | http://discol.umk.edu.my/id/eprint/7831/ http://dx.doi.org/10.4028/www.scientific.net/AMR.626.980 |
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