Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nanosilver in Semiconductor and Electronic Component Application
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Trans-Tech Publication
2012
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Online Access: | http://discol.umk.edu.my/id/eprint/7882/1/AMR.626.980.pdf http://discol.umk.edu.my/id/eprint/7882/ http://dx.doi.org/10.4028/www.scientific.net/AMR.626.980 |
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my.umk.eprints.78822022-05-23T10:23:45Z http://discol.umk.edu.my/id/eprint/7882/ Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nanosilver in Semiconductor and Electronic Component Application Mohamed, Mazlan Atan, Rahim Mustafa Al Bakri, Abdullah Mohd Ahmad, Muhammad Iqbal Yusoff, Mohd Huzaifah Saad, Fathinul Najib Ahmad Trans-Tech Publication 2012 Non-Indexed Article NonPeerReviewed text en http://discol.umk.edu.my/id/eprint/7882/1/AMR.626.980.pdf Mohamed, Mazlan and Atan, Rahim and Mustafa Al Bakri, Abdullah Mohd and Ahmad, Muhammad Iqbal and Yusoff, Mohd Huzaifah and Saad, Fathinul Najib Ahmad (2012) Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nanosilver in Semiconductor and Electronic Component Application. Advanced Materials Research, 626. pp. 980-988. ISSN 1662-8985 http://dx.doi.org/10.4028/www.scientific.net/AMR.626.980 doi:10.4028/www.scientific.net/AMR.626.980 doi:10.4028/www.scientific.net/AMR.626.980 |
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English |
format |
Non-Indexed Article |
author |
Mohamed, Mazlan Atan, Rahim Mustafa Al Bakri, Abdullah Mohd Ahmad, Muhammad Iqbal Yusoff, Mohd Huzaifah Saad, Fathinul Najib Ahmad |
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Mohamed, Mazlan Atan, Rahim Mustafa Al Bakri, Abdullah Mohd Ahmad, Muhammad Iqbal Yusoff, Mohd Huzaifah Saad, Fathinul Najib Ahmad Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nanosilver in Semiconductor and Electronic Component Application |
author_facet |
Mohamed, Mazlan Atan, Rahim Mustafa Al Bakri, Abdullah Mohd Ahmad, Muhammad Iqbal Yusoff, Mohd Huzaifah Saad, Fathinul Najib Ahmad |
author_sort |
Mohamed, Mazlan |
title |
Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nanosilver in Semiconductor and Electronic Component Application |
title_short |
Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nanosilver in Semiconductor and Electronic Component Application |
title_full |
Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nanosilver in Semiconductor and Electronic Component Application |
title_fullStr |
Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nanosilver in Semiconductor and Electronic Component Application |
title_full_unstemmed |
Three Dimensional Simulation of Thermal Pad Using Nanomaterial, Nanosilver in Semiconductor and Electronic Component Application |
title_sort |
three dimensional simulation of thermal pad using nanomaterial, nanosilver in semiconductor and electronic component application |
publisher |
Trans-Tech Publication |
publishDate |
2012 |
url |
http://discol.umk.edu.my/id/eprint/7882/1/AMR.626.980.pdf http://discol.umk.edu.my/id/eprint/7882/ http://dx.doi.org/10.4028/www.scientific.net/AMR.626.980 |
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