Evaluation of machine learning classifiers in faulty die prediction to maximize cost scrapping avoidance and assembly test capacity savings in semiconductor integrated circuit (IC) manufacturing

Semiconductor manufacturing is a complex and expensive process. The semiconductor packaging trending towards for more complex package with higher performance and lower power consumption. The silicon die is manufactured using smaller fab process technology node and packaging technology is using more...

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Main Authors: Mohd Fazil, Azlan Faizal, Mohd Shaharanee, Izwan Nizal, Mohd Jamil, Jastini
格式: Article
語言:English
出版: AIP Publishing LLC 2019
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在線閱讀:http://repo.uum.edu.my/27050/1/fazil2019.pdf
http://repo.uum.edu.my/27050/
http://doi.org/10.1063/1.5121089
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