A review of graphene reinforced Cu matrix composites for thermal management of smart electronics
Heat dissipation remains a key challenge to be addressed, determining the performance and durability of smart electronic devices. Graphene reinforced metal matrix composites have been extensively studied as a thermal management material due to their high thermal conductivity and low coefficient of t...
Saved in:
| Main Authors: | , , , , , , |
|---|---|
| 格式: | Article |
| 出版: |
Elsevier Ltd
2021
|
| 在线阅读: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85101896828&doi=10.1016%2fj.compositesa.2021.106357&partnerID=40&md5=ea63a56ddaceb66c9d5630e12b743cca http://eprints.utp.edu.my/23878/ |
| 标签: |
添加标签
没有标签, 成为第一个标记此记录!
|