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A review of graphene reinforced Cu matrix composites for thermal management of smart electronics

Heat dissipation remains a key challenge to be addressed, determining the performance and durability of smart electronic devices. Graphene reinforced metal matrix composites have been extensively studied as a thermal management material due to their high thermal conductivity and low coefficient of t...

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Main Authors: Ali, S., Ahmad, F., Yusoff, P.S.M.M., Muhamad, N., Oñate, E., Raza, M.R., Malik, K.
Format: Article
Published: Elsevier Ltd 2021
Online Access:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85101896828&doi=10.1016%2fj.compositesa.2021.106357&partnerID=40&md5=ea63a56ddaceb66c9d5630e12b743cca
http://eprints.utp.edu.my/23878/
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spelling my.utp.eprints.238782021-08-19T13:25:08Z A review of graphene reinforced Cu matrix composites for thermal management of smart electronics Ali, S. Ahmad, F. Yusoff, P.S.M.M. Muhamad, N. Oñate, E. Raza, M.R. Malik, K. Heat dissipation remains a key challenge to be addressed, determining the performance and durability of smart electronic devices. Graphene reinforced metal matrix composites have been extensively studied as a thermal management material due to their high thermal conductivity and low coefficient of thermal expansion. The emphasis of this review is pivoted on the thermal conductivity enhancement of graphene reinforced Cu matrix composites developed in the recent literature. An overview of factors affecting thermal conductivity of composite namely defect processing route, density, graphene derivative, lateral size, concentration, alignment, graphene/matrix interfacial bonding and graphene modification are discussed. An extensive weightage is given to the processing route as it is the most influential factor in determining the enhancement efficiency. Furthermore, graphene based functional products such as heat spreader and heat sink developed for heat dissipation of electronic devices are also reviewed. Finally, the development and outlook for graphene based Cu composites are presented. © 2021 Elsevier Ltd Elsevier Ltd 2021 Article NonPeerReviewed https://www.scopus.com/inward/record.uri?eid=2-s2.0-85101896828&doi=10.1016%2fj.compositesa.2021.106357&partnerID=40&md5=ea63a56ddaceb66c9d5630e12b743cca Ali, S. and Ahmad, F. and Yusoff, P.S.M.M. and Muhamad, N. and Oñate, E. and Raza, M.R. and Malik, K. (2021) A review of graphene reinforced Cu matrix composites for thermal management of smart electronics. Composites Part A: Applied Science and Manufacturing, 144 . http://eprints.utp.edu.my/23878/
institution Universiti Teknologi Petronas
building UTP Resource Centre
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Petronas
content_source UTP Institutional Repository
url_provider http://eprints.utp.edu.my/
description Heat dissipation remains a key challenge to be addressed, determining the performance and durability of smart electronic devices. Graphene reinforced metal matrix composites have been extensively studied as a thermal management material due to their high thermal conductivity and low coefficient of thermal expansion. The emphasis of this review is pivoted on the thermal conductivity enhancement of graphene reinforced Cu matrix composites developed in the recent literature. An overview of factors affecting thermal conductivity of composite namely defect processing route, density, graphene derivative, lateral size, concentration, alignment, graphene/matrix interfacial bonding and graphene modification are discussed. An extensive weightage is given to the processing route as it is the most influential factor in determining the enhancement efficiency. Furthermore, graphene based functional products such as heat spreader and heat sink developed for heat dissipation of electronic devices are also reviewed. Finally, the development and outlook for graphene based Cu composites are presented. © 2021 Elsevier Ltd
format Article
author Ali, S.
Ahmad, F.
Yusoff, P.S.M.M.
Muhamad, N.
Oñate, E.
Raza, M.R.
Malik, K.
spellingShingle Ali, S.
Ahmad, F.
Yusoff, P.S.M.M.
Muhamad, N.
Oñate, E.
Raza, M.R.
Malik, K.
A review of graphene reinforced Cu matrix composites for thermal management of smart electronics
author_facet Ali, S.
Ahmad, F.
Yusoff, P.S.M.M.
Muhamad, N.
Oñate, E.
Raza, M.R.
Malik, K.
author_sort Ali, S.
title A review of graphene reinforced Cu matrix composites for thermal management of smart electronics
title_short A review of graphene reinforced Cu matrix composites for thermal management of smart electronics
title_full A review of graphene reinforced Cu matrix composites for thermal management of smart electronics
title_fullStr A review of graphene reinforced Cu matrix composites for thermal management of smart electronics
title_full_unstemmed A review of graphene reinforced Cu matrix composites for thermal management of smart electronics
title_sort review of graphene reinforced cu matrix composites for thermal management of smart electronics
publisher Elsevier Ltd
publishDate 2021
url https://www.scopus.com/inward/record.uri?eid=2-s2.0-85101896828&doi=10.1016%2fj.compositesa.2021.106357&partnerID=40&md5=ea63a56ddaceb66c9d5630e12b743cca
http://eprints.utp.edu.my/23878/
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score 13.223943

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