A review of graphene reinforced Cu matrix composites for thermal management of smart electronics
Heat dissipation remains a key challenge to be addressed, determining the performance and durability of smart electronic devices. Graphene reinforced metal matrix composites have been extensively studied as a thermal management material due to their high thermal conductivity and low coefficient of t...
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| 主要な著者: | , , , , , , |
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| フォーマット: | 論文 |
| 出版事項: |
Elsevier Ltd
2021
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| オンライン･アクセス: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85101896828&doi=10.1016%2fj.compositesa.2021.106357&partnerID=40&md5=ea63a56ddaceb66c9d5630e12b743cca http://eprints.utp.edu.my/23878/ |
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