Design for Cold Test Elimination - Facing the Inverse Temperature Dependance (ITD) Challenge
Historically, circuits that operate in a high-temperature region could cause an increase in the total delay (td) especially in the process technology prior to the 90nm node. This was because both interconnects and transistors were slowing down as the temperature rose. However, for transistors with t...
Saved in:
Main Authors: | Latif, Mohd Azman Abdul, Zain Ali, Noohul Basheer, Hussin, Fawnizu Azmadi |
---|---|
Format: | Conference or Workshop Item |
Published: |
2012
|
Online Access: | http://eprints.utp.edu.my/11991/1/06271971.pdf http://eprints.utp.edu.my/11991/ |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Design for cold test elimination -Facing the Inverse Temperature Dependence (ITD) challenge
by: Noohul Basheer bin Zain Ali ,, et al.
Published: (2012) -
Resistance dependent delay behaviour of resistive open faults in multi voltage designs
by: Mohammadat, Mohamed Tag Elsir, et al.
Published: (2012) -
Investigation of Capacitance Dependence on Droplet Volume in MEDA Based Biochips
by: Shukla, Vineeta, et al.
Published: (2016) -
On testing of MEDA based digital microfluidics biochips
by: Shukla , Vineeta, et al.
Published: (2013) -
On Using IEEE 1500 Standard for Functional Testing
by: Ali, Ghazanfar, et al.
Published: (2013)