Tin whiskers formation and growth on immersion sn surface finish under external stresses by bending
Deposited tin (Sn) layers used as lead-free solderable finish on the semiconductor devices are known to form whiskers. These whiskers are a single crystal of tin that spontaneously grows from the surface of tin within weeks to years. Thus, they can cause shorts and the failure of a whole electronic...
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| Main Authors: | , , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2017
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/97250/1/NlMAmin2017_TinWhiskersFormationandGrowth.pdf http://eprints.utm.my/id/eprint/97250/ http://dx.doi.org/10.1088/1757-899X/238/1/012001 |
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