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Tin whiskers formation and growth on immersion sn surface finish under external stresses by bending

Deposited tin (Sn) layers used as lead-free solderable finish on the semiconductor devices are known to form whiskers. These whiskers are a single crystal of tin that spontaneously grows from the surface of tin within weeks to years. Thus, they can cause shorts and the failure of a whole electronic...

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Main Authors: Amin, N. L. M., Yusof, S. Z., Kahar, M. N. A., Bakar, T. A. A., Fadil, N. A.
Format: Conference or Workshop Item
Language:English
Published: 2017
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.utm.my/id/eprint/97250/1/NlMAmin2017_TinWhiskersFormationandGrowth.pdf
http://eprints.utm.my/id/eprint/97250/
http://dx.doi.org/10.1088/1757-899X/238/1/012001
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spelling my.utm.972502022-09-23T04:32:03Z http://eprints.utm.my/id/eprint/97250/ Tin whiskers formation and growth on immersion sn surface finish under external stresses by bending Amin, N. L. M. Yusof, S. Z. Kahar, M. N. A. Bakar, T. A. A. Fadil, N. A. TJ Mechanical engineering and machinery Deposited tin (Sn) layers used as lead-free solderable finish on the semiconductor devices are known to form whiskers. These whiskers are a single crystal of tin that spontaneously grows from the surface of tin within weeks to years. Thus, they can cause shorts and the failure of a whole electronic circuit. In this research, the effect of external stresses applied by bending on the tin whiskers formation and growth was investigated on immersion Sn surface finish. The plating time was 10 minutes to produce 1.4 μm coating thickness on the copper substrate and exposed for 1, 4, and 8 weeks under the environment of 30°C/60% RH for bent and non-bent samples. It was found that the non-bent Sn surface had uniform ts distributed on the entire surface. Unlike the non-bent Sn surface, the surface of bent samples had non-uniform tin whiskers distribution. The tin whiskers formed more and grew longer at the lower stress region of the bent surface as compared to the higher stress region, based on the micrograph observed using the field emission scanning electron microscopy (FESEM). 2017 Conference or Workshop Item PeerReviewed application/pdf en http://eprints.utm.my/id/eprint/97250/1/NlMAmin2017_TinWhiskersFormationandGrowth.pdf Amin, N. L. M. and Yusof, S. Z. and Kahar, M. N. A. and Bakar, T. A. A. and Fadil, N. A. (2017) Tin whiskers formation and growth on immersion sn surface finish under external stresses by bending. In: Joining and Welding Symposium 2017, 11 July 2017, Pahang, Malaysia. http://dx.doi.org/10.1088/1757-899X/238/1/012001
institution Universiti Teknologi Malaysia
building UTM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Malaysia
content_source UTM Institutional Repository
url_provider http://eprints.utm.my/
language English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Amin, N. L. M.
Yusof, S. Z.
Kahar, M. N. A.
Bakar, T. A. A.
Fadil, N. A.
Tin whiskers formation and growth on immersion sn surface finish under external stresses by bending
description Deposited tin (Sn) layers used as lead-free solderable finish on the semiconductor devices are known to form whiskers. These whiskers are a single crystal of tin that spontaneously grows from the surface of tin within weeks to years. Thus, they can cause shorts and the failure of a whole electronic circuit. In this research, the effect of external stresses applied by bending on the tin whiskers formation and growth was investigated on immersion Sn surface finish. The plating time was 10 minutes to produce 1.4 μm coating thickness on the copper substrate and exposed for 1, 4, and 8 weeks under the environment of 30°C/60% RH for bent and non-bent samples. It was found that the non-bent Sn surface had uniform ts distributed on the entire surface. Unlike the non-bent Sn surface, the surface of bent samples had non-uniform tin whiskers distribution. The tin whiskers formed more and grew longer at the lower stress region of the bent surface as compared to the higher stress region, based on the micrograph observed using the field emission scanning electron microscopy (FESEM).
format Conference or Workshop Item
author Amin, N. L. M.
Yusof, S. Z.
Kahar, M. N. A.
Bakar, T. A. A.
Fadil, N. A.
author_facet Amin, N. L. M.
Yusof, S. Z.
Kahar, M. N. A.
Bakar, T. A. A.
Fadil, N. A.
author_sort Amin, N. L. M.
title Tin whiskers formation and growth on immersion sn surface finish under external stresses by bending
title_short Tin whiskers formation and growth on immersion sn surface finish under external stresses by bending
title_full Tin whiskers formation and growth on immersion sn surface finish under external stresses by bending
title_fullStr Tin whiskers formation and growth on immersion sn surface finish under external stresses by bending
title_full_unstemmed Tin whiskers formation and growth on immersion sn surface finish under external stresses by bending
title_sort tin whiskers formation and growth on immersion sn surface finish under external stresses by bending
publishDate 2017
url http://eprints.utm.my/id/eprint/97250/1/NlMAmin2017_TinWhiskersFormationandGrowth.pdf
http://eprints.utm.my/id/eprint/97250/
http://dx.doi.org/10.1088/1757-899X/238/1/012001
_version_ 1745562357468233728
score 13.211869

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