Silicon nanohole arrays fabricated by electron beam lithography and reactive ion etching
The fabrication of silicon nanohole (SiNH) using a combination of electron beam lithography (EBL) and reactive ion etching (RIE) processes is reported. The optimum exposure dose of EBL process was found to be in the range of 210-240 µC/cm2 due to small enlargement of hole diameter after pattern deve...
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my.utm.892592021-02-22T06:01:19Z http://eprints.utm.my/id/eprint/89259/ Silicon nanohole arrays fabricated by electron beam lithography and reactive ion etching Rahmasari, Lita Abdullah, Mohd. Faizol Md. Zain, Ahmad Rifqi Hashim, Abdul Manaf TA Engineering (General). Civil engineering (General) The fabrication of silicon nanohole (SiNH) using a combination of electron beam lithography (EBL) and reactive ion etching (RIE) processes is reported. The optimum exposure dose of EBL process was found to be in the range of 210-240 µC/cm2 due to small enlargement of hole diameter after pattern development process. The anisotropic etching and isotropic etching was achieved at low and high reaction pressures, respectively. As expected, the etching rate increase with time and RF power. A relatively smooth and well-defined NH has been obtained at RF power of 100 W and reaction pressure of 0.08 Torr, which is suitable to be applied for optical waveguide. Penerbit UKM 2019-06 Article PeerReviewed application/pdf en http://eprints.utm.my/id/eprint/89259/1/LitaRahmasari2019_SiliconNanoholeArraysFabricatedbyElectron.pdf Rahmasari, Lita and Abdullah, Mohd. Faizol and Md. Zain, Ahmad Rifqi and Hashim, Abdul Manaf (2019) Silicon nanohole arrays fabricated by electron beam lithography and reactive ion etching. Sains Malaysiana, 48 (6). pp. 1157-1161. ISSN 0126-6039 http://dx.doi.org/10.17576/jsm-2019-4806-01 DOI:10.17576/jsm-2019-4806-01 |
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TA Engineering (General). Civil engineering (General) Rahmasari, Lita Abdullah, Mohd. Faizol Md. Zain, Ahmad Rifqi Hashim, Abdul Manaf Silicon nanohole arrays fabricated by electron beam lithography and reactive ion etching |
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The fabrication of silicon nanohole (SiNH) using a combination of electron beam lithography (EBL) and reactive ion etching (RIE) processes is reported. The optimum exposure dose of EBL process was found to be in the range of 210-240 µC/cm2 due to small enlargement of hole diameter after pattern development process. The anisotropic etching and isotropic etching was achieved at low and high reaction pressures, respectively. As expected, the etching rate increase with time and RF power. A relatively smooth and well-defined NH has been obtained at RF power of 100 W and reaction pressure of 0.08 Torr, which is suitable to be applied for optical waveguide. |
format |
Article |
author |
Rahmasari, Lita Abdullah, Mohd. Faizol Md. Zain, Ahmad Rifqi Hashim, Abdul Manaf |
author_facet |
Rahmasari, Lita Abdullah, Mohd. Faizol Md. Zain, Ahmad Rifqi Hashim, Abdul Manaf |
author_sort |
Rahmasari, Lita |
title |
Silicon nanohole arrays fabricated by electron beam lithography and reactive ion etching |
title_short |
Silicon nanohole arrays fabricated by electron beam lithography and reactive ion etching |
title_full |
Silicon nanohole arrays fabricated by electron beam lithography and reactive ion etching |
title_fullStr |
Silicon nanohole arrays fabricated by electron beam lithography and reactive ion etching |
title_full_unstemmed |
Silicon nanohole arrays fabricated by electron beam lithography and reactive ion etching |
title_sort |
silicon nanohole arrays fabricated by electron beam lithography and reactive ion etching |
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Penerbit UKM |
publishDate |
2019 |
url |
http://eprints.utm.my/id/eprint/89259/1/LitaRahmasari2019_SiliconNanoholeArraysFabricatedbyElectron.pdf http://eprints.utm.my/id/eprint/89259/ http://dx.doi.org/10.17576/jsm-2019-4806-01 |
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