Power-aware through-silicon-via minimization by partitioning finite state machine with datapath
This paper proposes an extended Finite State Machine with Datapath (FSMD) partitioning that performs three-dimensional (3D) high level synthesis (HLS) with objectives to minimize the number of through-silicon-via (TSV) and to equip the synthesized system with power gating capability to save power. T...
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Institute of Electrical and Electronics Engineers Inc.
2016
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my.utm.731082017-11-18T00:48:46Z http://eprints.utm.my/id/eprint/73108/ Power-aware through-silicon-via minimization by partitioning finite state machine with datapath Abdullah, A. C. Ooi, C. Y. Ismail, N. B. Mohammad, N. B. T Technology (General) This paper proposes an extended Finite State Machine with Datapath (FSMD) partitioning that performs three-dimensional (3D) high level synthesis (HLS) with objectives to minimize the number of through-silicon-via (TSV) and to equip the synthesized system with power gating capability to save power. The original FSMD partitioning was proposed for conventional low-power 2D system and was only employed before HLS. Our extended FSMD partitioning problem is formulated using integer linear programming (ILP) to minimize TSVs under constraints of footprint area, power limit, number of die stacks and HLS rules. Case study has been conducted on Discrete Cosine Transform (DCT) circuit to evaluate the effectiveness of the proposed method in terms of number of TSVs and power dissipation. Besides, power gating capability is verified and analyzed. Institute of Electrical and Electronics Engineers Inc. 2016 Conference or Workshop Item PeerReviewed Abdullah, A. C. and Ooi, C. Y. and Ismail, N. B. and Mohammad, N. B. (2016) Power-aware through-silicon-via minimization by partitioning finite state machine with datapath. In: 2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016, 22 May 2016 through 25 May 2016, Montreal's Sheraton CentreMontreal; Canada. https://www.scopus.com/inward/record.uri?eid=2-s2.0-84983419729&doi=10.1109%2fISCAS.2016.7538954&partnerID=40&md5=33ab547ae1e73ef425675a417f226e92 |
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T Technology (General) Abdullah, A. C. Ooi, C. Y. Ismail, N. B. Mohammad, N. B. Power-aware through-silicon-via minimization by partitioning finite state machine with datapath |
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This paper proposes an extended Finite State Machine with Datapath (FSMD) partitioning that performs three-dimensional (3D) high level synthesis (HLS) with objectives to minimize the number of through-silicon-via (TSV) and to equip the synthesized system with power gating capability to save power. The original FSMD partitioning was proposed for conventional low-power 2D system and was only employed before HLS. Our extended FSMD partitioning problem is formulated using integer linear programming (ILP) to minimize TSVs under constraints of footprint area, power limit, number of die stacks and HLS rules. Case study has been conducted on Discrete Cosine Transform (DCT) circuit to evaluate the effectiveness of the proposed method in terms of number of TSVs and power dissipation. Besides, power gating capability is verified and analyzed. |
| format |
Conference or Workshop Item |
| author |
Abdullah, A. C. Ooi, C. Y. Ismail, N. B. Mohammad, N. B. |
| author_facet |
Abdullah, A. C. Ooi, C. Y. Ismail, N. B. Mohammad, N. B. |
| author_sort |
Abdullah, A. C. |
| title |
Power-aware through-silicon-via minimization by partitioning finite state machine with datapath |
| title_short |
Power-aware through-silicon-via minimization by partitioning finite state machine with datapath |
| title_full |
Power-aware through-silicon-via minimization by partitioning finite state machine with datapath |
| title_fullStr |
Power-aware through-silicon-via minimization by partitioning finite state machine with datapath |
| title_full_unstemmed |
Power-aware through-silicon-via minimization by partitioning finite state machine with datapath |
| title_sort |
power-aware through-silicon-via minimization by partitioning finite state machine with datapath |
| publisher |
Institute of Electrical and Electronics Engineers Inc. |
| publishDate |
2016 |
| url |
http://eprints.utm.my/id/eprint/73108/ https://www.scopus.com/inward/record.uri?eid=2-s2.0-84983419729&doi=10.1109%2fISCAS.2016.7538954&partnerID=40&md5=33ab547ae1e73ef425675a417f226e92 |
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1643656577901658112 |
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13.223943 |