Solder joint fatigue in a surface mount assembly subjected to mechanical loading
A mechanical approach employing cyclic twisting deformation to a surface mount assembly is examined as an alternative to temperature cycling for evaluating solder joints fatigue performance. This highly accelerated test is aimed at reducing solder joint reliability testing cycle time. In this study,...
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| Main Authors: | , , , |
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| Format: | Article |
| Published: |
Institute of Electrical and Electronics Engineers
2007
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/7093/ http://ieeexplore.ieee.org/document/1614444/ |
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