Fluid dynamic simulation for diffusion solder die bond
This thesis investigates the computational fluid dynamics simulation of NiSn diffusion solder die bond process simulation methodology. As semiconductor industry is moving towards manufacturing complex and cost saving packages, more material and process methodology is being explored. The current appr...
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| フォーマット: | 学位論文 |
| 言語: | English English |
| 出版事項: |
2021
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| 主題: | |
| オンライン･アクセス: | http://eprints.utem.edu.my/id/eprint/26853/1/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf http://eprints.utem.edu.my/id/eprint/26853/2/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf http://eprints.utem.edu.my/id/eprint/26853/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=121725 |
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http://eprints.utem.edu.my/id/eprint/26853/1/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdfhttp://eprints.utem.edu.my/id/eprint/26853/2/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf
http://eprints.utem.edu.my/id/eprint/26853/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=121725