Fluid dynamic simulation for diffusion solder die bond
This thesis investigates the computational fluid dynamics simulation of NiSn diffusion solder die bond process simulation methodology. As semiconductor industry is moving towards manufacturing complex and cost saving packages, more material and process methodology is being explored. The current appr...
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| Format: | Thesis |
| Language: | English English |
| Published: |
2021
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/26853/1/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf http://eprints.utem.edu.my/id/eprint/26853/2/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf http://eprints.utem.edu.my/id/eprint/26853/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=121725 |
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Internet
http://eprints.utem.edu.my/id/eprint/26853/1/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdfhttp://eprints.utem.edu.my/id/eprint/26853/2/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf
http://eprints.utem.edu.my/id/eprint/26853/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=121725