Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame
Several candidate alloys have been suggested as high-temperature lead-free solder for Si die attachment by different researchers. Among them, Zn-Al based alloys have proper melting range and excellent thermal/electrical properties. In this study, Zn-Al-Mg-Ga solder wire was used to attach Ti/Ni/Ag m...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Published: |
Springer
2012
|
| Subjects: | |
| Online Access: | http://eprints.um.edu.my/5453/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|