صورة الغلاف

Fluid dynamic simulation for diffusion solder die bond

This thesis investigates the computational fluid dynamics simulation of NiSn diffusion solder die bond process simulation methodology. As semiconductor industry is moving towards manufacturing complex and cost saving packages, more material and process methodology is being explored. The current appr...

وصف كامل

محفوظ في:
التفاصيل البيبلوغرافية
المؤلف الرئيسي: Nandagopal, Vanisha Ashweeni
التنسيق: أطروحة
اللغة:English
English
منشور في: 2021
الموضوعات:
T Technology (General)
TA Engineering (General). Civil engineering (General)
الوصول للمادة أونلاين:http://eprints.utem.edu.my/id/eprint/26853/1/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf
http://eprints.utem.edu.my/id/eprint/26853/2/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf
http://eprints.utem.edu.my/id/eprint/26853/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=121725
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id my.utem.eprints.26853
record_format eprints
spelling my.utem.eprints.268532023-05-17T09:16:03Z http://eprints.utem.edu.my/id/eprint/26853/ Fluid dynamic simulation for diffusion solder die bond Nandagopal, Vanisha Ashweeni T Technology (General) TA Engineering (General). Civil engineering (General) This thesis investigates the computational fluid dynamics simulation of NiSn diffusion solder die bond process simulation methodology. As semiconductor industry is moving towards manufacturing complex and cost saving packages, more material and process methodology is being explored. The current approach of the semiconductor manufacturing industry has resulted in many new materials that are able to save manufacturing cost, but has the same or a better performance as the existing material. Simulation is useful during these product development activities in order to predict the process parameters and output results under multiple desired conditions. A general computational fluid dynamics model that represents packages of different material conditions, process temperature and material properties is derived. Multiple process parameters are considered during the simulation such as machine temperature profile, material properties and et cetera. These simulations are utilizing finite element method in ANSYS simulation software. The stress simulation is done on die bond process to analyze the robustness of the materials at every assembly step before it is assembled into one single package. A complete analysis is compiled to deter-mine the performance of new material on die bond process so that necessary measures and precautions can be done. The results of the study indicate that the computational fluid dynamics model is a general model that is limited to material properties. The computational fluid dynamics model is limited to a few package size groups. In the future, investigation can be extended into different applications that supports other multiple industries. 2021 Thesis NonPeerReviewed text en http://eprints.utem.edu.my/id/eprint/26853/1/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf text en http://eprints.utem.edu.my/id/eprint/26853/2/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf Nandagopal, Vanisha Ashweeni (2021) Fluid dynamic simulation for diffusion solder die bond. Masters thesis, Universiti Teknikal Malaysia Melaka. https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=121725
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
English
topic T Technology (General)
TA Engineering (General). Civil engineering (General)
spellingShingle T Technology (General)
TA Engineering (General). Civil engineering (General)
Nandagopal, Vanisha Ashweeni
Fluid dynamic simulation for diffusion solder die bond
description This thesis investigates the computational fluid dynamics simulation of NiSn diffusion solder die bond process simulation methodology. As semiconductor industry is moving towards manufacturing complex and cost saving packages, more material and process methodology is being explored. The current approach of the semiconductor manufacturing industry has resulted in many new materials that are able to save manufacturing cost, but has the same or a better performance as the existing material. Simulation is useful during these product development activities in order to predict the process parameters and output results under multiple desired conditions. A general computational fluid dynamics model that represents packages of different material conditions, process temperature and material properties is derived. Multiple process parameters are considered during the simulation such as machine temperature profile, material properties and et cetera. These simulations are utilizing finite element method in ANSYS simulation software. The stress simulation is done on die bond process to analyze the robustness of the materials at every assembly step before it is assembled into one single package. A complete analysis is compiled to deter-mine the performance of new material on die bond process so that necessary measures and precautions can be done. The results of the study indicate that the computational fluid dynamics model is a general model that is limited to material properties. The computational fluid dynamics model is limited to a few package size groups. In the future, investigation can be extended into different applications that supports other multiple industries.
format Thesis
author Nandagopal, Vanisha Ashweeni
author_facet Nandagopal, Vanisha Ashweeni
author_sort Nandagopal, Vanisha Ashweeni
title Fluid dynamic simulation for diffusion solder die bond
title_short Fluid dynamic simulation for diffusion solder die bond
title_full Fluid dynamic simulation for diffusion solder die bond
title_fullStr Fluid dynamic simulation for diffusion solder die bond
title_full_unstemmed Fluid dynamic simulation for diffusion solder die bond
title_sort fluid dynamic simulation for diffusion solder die bond
publishDate 2021
url http://eprints.utem.edu.my/id/eprint/26853/1/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf
http://eprints.utem.edu.my/id/eprint/26853/2/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf
http://eprints.utem.edu.my/id/eprint/26853/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=121725
_version_ 1768012369274863616
score 13.251813

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