Fluid dynamic simulation for diffusion solder die bond
This thesis investigates the computational fluid dynamics simulation of NiSn diffusion solder die bond process simulation methodology. As semiconductor industry is moving towards manufacturing complex and cost saving packages, more material and process methodology is being explored. The current appr...
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| 第一著者: | |
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| フォーマット: | 学位論文 |
| 言語: | English English |
| 出版事項: |
2021
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| 主題: | |
| オンライン･アクセス: | http://eprints.utem.edu.my/id/eprint/26853/1/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf http://eprints.utem.edu.my/id/eprint/26853/2/Fluid%20dynamic%20simulation%20for%20diffusion%20solder%20die%20bond.pdf http://eprints.utem.edu.my/id/eprint/26853/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=121725 |
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| 要約: | This thesis investigates the computational fluid dynamics simulation of NiSn diffusion solder die bond process simulation methodology. As semiconductor industry is moving towards manufacturing complex and cost saving packages, more material and process methodology is being explored. The current approach of the semiconductor manufacturing industry has resulted in many new materials that are able to save manufacturing cost, but has the same or a better performance as the existing material. Simulation is useful during these product development activities in order to predict the process parameters and output results under multiple desired conditions. A general computational fluid dynamics model that represents packages of different material conditions, process temperature and material properties is derived. Multiple process parameters are considered during the simulation such as machine temperature profile, material properties and et cetera. These simulations are utilizing finite element method in ANSYS simulation software. The stress simulation is done on die bond process to analyze the robustness of the materials at every assembly step before it is assembled into one single package. A complete analysis is compiled to deter-mine the performance of new material on die bond process so that necessary measures and precautions can be done. The results of the study indicate that the computational fluid dynamics model is a general model that is limited to material properties. The computational fluid dynamics model is limited to a few package size groups. In the future, investigation can be extended into different applications that supports other multiple industries. |
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